发明名称 Semiconductor Device and Method of Forming IPD Structure Using Smooth Conductive Layer and Bottom-side Conductive Layer
摘要 A semiconductor device is made by forming a smooth conductive layer over a substrate. A first insulating layer is formed over a first surface of the smooth conductive layer. A first conductive layer is formed over the first insulating layer. A second insulating layer is formed over the first insulating layer and first conductive layer. The substrate is removed. A second conductive layer is formed over a second surface of the smooth conductive layer opposite the first surface of the smooth conductive layer. A third insulating layer is formed over the second conductive layer. The second conductive layer, smooth conductive layer, first insulating layer, and first conductive layer constitute a MIM capacitor. A portion of the second conductive layer includes an inductor. The smooth conductive layer has a smooth surface to reduce particles and hill-locks which decreases ESR, increases Q factor, and increases ESD of the MIM capacitor.
申请公布号 US2010301450(A1) 申请公布日期 2010.12.02
申请号 US20090472170 申请日期 2009.05.26
申请人 STATS CHIPPAC, LTD. 发明人 LIN YAOJIAN
分类号 H01L29/92;H01L21/77 主分类号 H01L29/92
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