| 发明名称 |
ADHESIVE COMPOSITION, ADHESIVE SHEET FOR CONNECTION OF CIRCUIT MEMBER, AND PROCESS FOR MANUFACTURE OF SEMICONDUCTOR DEVICE |
| 摘要 |
<p>An adhesive composition comprising (A) a thermoplastic resin, (B) a heat-curable resin, (C) a latent curing agent, (D) an inorganic filler, (E) organic microparticles, and (F) a powdery compound that has a solid form at room temperature and has the maximum particle diameter of 25 µm or less, wherein the component (F) comprises at least one compound selected from a compound having a carboxyl group, a compound having a methylol group and a hydrazide compound.</p> |
| 申请公布号 |
WO2010137445(A1) |
申请公布日期 |
2010.12.02 |
| 申请号 |
WO2010JP57671 |
申请日期 |
2010.04.30 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;NAGAI AKIRA;OOKUBO KEISUKE |
发明人 |
NAGAI AKIRA;OOKUBO KEISUKE |
| 分类号 |
C09J201/00;C09J7/02;C09J11/04;C09J11/06;C09J163/00;H01L21/60;H01L23/29;H01L23/31 |
主分类号 |
C09J201/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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