发明名称 |
METHOD FOR MANUFACTURING PIEZOELECTRIC COMPONENT AND PIEZOELECTRIC COMPONENT MANUFACTURED WITH THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a piezoelectric component improved in electric characteristics and weatherability by forming a protecting film over all the surface of a piezoelectric element or in any optional portion on the surface according to a lifting-off method. <P>SOLUTION: The present invention relates to a method for manufacturing a piezoelectric component and a piezoelectric component manufactured with the same. The piezoelectric component includes: an aggregated piezoelectric substrate; a piezoelectric element comprising at least one vibrating part formed on a principal surface of the aggregated piezoelectric substrate and a wiring electrode connected to the vibrating part; a protecting film formed on a surface of the piezoelectric element; an inter-layer insulating film formed on the principal surface of the piezoelectric substrate excluding the electrode part of the piezoelectric element; and a hollow structure part provided to surround an upper surface of the piezoelectric element. The piezoelectric component further includes a terminal electrode connected to the wiring electrode and a solder ball electrode formed on the terminal electrode. The method for manufacturing includes: applying a photoresist over all the surface of the piezoelectric element when forming the protecting film; then forming the insulating film after patterning according to lithography; and removing (releasing) the photoresist in a desired portion and the insulating film formed thereon according to the lifting-off method. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010273200(A) |
申请公布日期 |
2010.12.02 |
申请号 |
JP20090124240 |
申请日期 |
2009.05.22 |
申请人 |
NIPPON DEMPA KOGYO CO LTD |
发明人 |
TSUDA TOSHIMASA |
分类号 |
H03H3/08;H01L23/12;H01L41/09;H01L41/18;H01L41/22;H01L41/23;H01L41/39;H03H3/007;H03H3/02;H03H9/145;H03H9/17;H03H9/24 |
主分类号 |
H03H3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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