发明名称 METHOD FOR MANUFACTURING PIEZOELECTRIC COMPONENT AND PIEZOELECTRIC COMPONENT MANUFACTURED WITH THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To manufacture a piezoelectric component improved in electric characteristics and weatherability by forming a protecting film over all the surface of a piezoelectric element or in any optional portion on the surface according to a lifting-off method. <P>SOLUTION: The present invention relates to a method for manufacturing a piezoelectric component and a piezoelectric component manufactured with the same. The piezoelectric component includes: an aggregated piezoelectric substrate; a piezoelectric element comprising at least one vibrating part formed on a principal surface of the aggregated piezoelectric substrate and a wiring electrode connected to the vibrating part; a protecting film formed on a surface of the piezoelectric element; an inter-layer insulating film formed on the principal surface of the piezoelectric substrate excluding the electrode part of the piezoelectric element; and a hollow structure part provided to surround an upper surface of the piezoelectric element. The piezoelectric component further includes a terminal electrode connected to the wiring electrode and a solder ball electrode formed on the terminal electrode. The method for manufacturing includes: applying a photoresist over all the surface of the piezoelectric element when forming the protecting film; then forming the insulating film after patterning according to lithography; and removing (releasing) the photoresist in a desired portion and the insulating film formed thereon according to the lifting-off method. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010273200(A) 申请公布日期 2010.12.02
申请号 JP20090124240 申请日期 2009.05.22
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 TSUDA TOSHIMASA
分类号 H03H3/08;H01L23/12;H01L41/09;H01L41/18;H01L41/22;H01L41/23;H01L41/39;H03H3/007;H03H3/02;H03H9/145;H03H9/17;H03H9/24 主分类号 H03H3/08
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