| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a protective sheet from contacting a sensor structure, and to prevent breakage of the sensor structure. <P>SOLUTION: Transport to a dicing device and a dicing process are executed while the shapes of cap parts 5 of a protective sheet 1 are kept by a tool 4. Dicing cut is executed from the back face side of a semiconductor substrate 11. Thereby, deformation of the protective sheet 1 can be prevented in the transport and the dicing process, and the protective sheet 1 can be prevented from contacting the sensor structure 10, whereby the breakage of the sensor structure 10 can be prevented. Since the dicing cut is executed from the back face side of the semiconductor substrate 11, the tool 4 is prevented from interfering with a dicing blade 13 to become a hindrance even if the tool 4 is not removed from the protective sheet 1, and the dicing process can be surely executed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
