METHOD AND STRUCTURE FOR CONNECTION, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method of connection for achieving an adhesive connection structure inexpensively while simplifying a manufacturing process, and to provide an electronic apparatus. SOLUTION: A mother board 20 includes: a rigid board 21; and an adhesive connecting electrode 22 and a solder connecting electrode 26 formed on the rigid board 21. The surface of each of electrodes 22 and 26 is covered with an organic film 25. After forming a solder connection structure D with a solder layer 50, the organic film 25 is softened by immersing the organic film 25 in an organic solvent 61 in a bath 60 of the organic solvent. Then, electrodes 12 and 22 are connected by using an adhesive 30 to form an adhesive connection structure C. Organic films 15 and 25 are an antioxidation film formed by an OSP treatment, and the organic film 25 is subjected to softening treatment after solder reflow etc. Accordingly, the solder connection structure and the adhesive connection structure can be formed smoothly. COPYRIGHT: (C)2011,JPO&INPIT