| 摘要 |
PROBLEM TO BE SOLVED: To reduce the consumption of solder when a substrate unit is manufactured. SOLUTION: In a shield member 20, eaves 23, protruding toward an opening 21OT on a counter circuit board side of side portions 21B, 21D, are formed on the counter circuit board side thereof. The eaves 23 reinforce the shield member 20 to suppress deformation of the shield member 20. Further, the shield member 20 has joint portions 22 on the circuit board side. The joint portions 22 are disposed at parts opposed to the eaves 23. The joint portions 22 have plane portions formed by bending circuit-board sides of the side portions 21B, 21D. COPYRIGHT: (C)2011,JPO&INPIT
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