发明名称 SOLDER ATTACHED CONTACT AND A METHOD OF MANUFACTURING THE SAME
摘要 There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.
申请公布号 US2010304625(A1) 申请公布日期 2010.12.02
申请号 US20070446432 申请日期 2007.10.30
申请人 NAKAMURA YUJI 发明人 NAKAMURA YUJI
分类号 H01R4/02;B23K1/20;B23K31/02 主分类号 H01R4/02
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