发明名称 FLEXIBLE CIRCUIT BOARD MATERIAL AND METHOD FOR PRODUCING THE SAME
摘要 A method for producing a flexible circuit board material having a polymer substrate and a copper layer. The method includes depositing a layer of titanium oxide to be between the polymer substrate and the copper layer. The layer of titanium oxide and the copper layer are deposited using vacuum methods.
申请公布号 US2010300731(A1) 申请公布日期 2010.12.02
申请号 US20080599651 申请日期 2008.05.07
申请人 FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 发明人 GUENTHER STEFFEN;SCHOENBERGER WALDEMAR;STRAACH STEFFEN;SCHILLER NICOLAS;KIRCHHOFF VOLKER
分类号 H05K1/09;C23C14/35 主分类号 H05K1/09
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