发明名称 |
A COVERED CU WIRE FOR BALL BONDING |
摘要 |
To provide a covered Cu wire for ball bonding which can be avoid inconvenience oxidation of core material of Cu and/or Cu alloy on ball forming after pulling and cutting away. A covered Cu wire comprising: core material of Cu-P alloy, and intermediate layer of Pd or Pt on the core material and surface layer of Au on the intermediate layer. |
申请公布号 |
KR20100126652(A) |
申请公布日期 |
2010.12.02 |
申请号 |
KR20107012234 |
申请日期 |
2009.09.01 |
申请人 |
TANAKA DENSHI KOGYO KABUSHIKI KAISHA |
发明人 |
YAMASHITA TSUTOMU;AKIMOTO HIDEYUKI;KUWAHARA TAKESHI;OKAZAKI JUNICHI |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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