| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate where a semiconductor chip having bumps in peripheral arrangement and bumps in area array arrangement mixedly is flip-chip bonded, and which has superior electric characteristics. SOLUTION: The wiring substrate 1 includes connection pads 11, 12 flip-chip bonded to the bumps of the semiconductor chip, wherein the connection pads 11 at the peripheral part 1a of the wiring substrate are formed in non-solder-mask-defined structure, and the connection pads 12 at the center part 1b of the wiring substrate 1 are formed in solder-mask-defined structure. COPYRIGHT: (C)2011,JPO&INPIT
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