| 摘要 |
PROBLEM TO BE SOLVED: To provide a table for cutting sheet cutting an adhesive sheet with high precision by preventing the adhesive sheet from causing wrinkle when cutting the sheet. SOLUTION: This table 13 for cutting sheet cuts an unnecessary adhesive sheet region sticking out of the outer periphery of a semiconductor wafer W as an unnecessary adhesive sheet S1 by a cutting device 15 after sticking the adhesive sheet S to the semiconductor wafer W. This table 13 is equipped with: an inner side table 52 supporting the semiconductor wafer W; and an outer side table 51 opposing to the unnecessary adhesive sheet S1 sticking out onto an outer side of the semiconductor wafer W. An upper face of the outer side table 51 is equipped with: a non-adhesively treated face 51A; and an adhesive member composed of a ring member 53 or a plate member 63 for sticking the adhesive sheet S. COPYRIGHT: (C)2011,JPO&INPIT
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