发明名称 |
Method for Manufacturing A Printed Circuit Board |
摘要 |
A method for manufacturing a printed circuit board is disclosed. The method comprises the steps of: providing a base board, wherein the base board comprises a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer.
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申请公布号 |
US2010299917(A1) |
申请公布日期 |
2010.12.02 |
申请号 |
US20100787426 |
申请日期 |
2010.05.26 |
申请人 |
CHANG HUNG-LIN;CHANG CHEN-CHUAN |
发明人 |
CHANG HUNG-LIN;CHANG CHEN-CHUAN |
分类号 |
H05K3/36 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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