| 摘要 |
<p>A resin composition comprising a resin (A) and composite particles (B) that are composed of particles (B1) having an average particle diameter of 100 nm to 50 µm and fine inorganic particles (B2) having an average particle diameter of 1-300 nm which are adherent to the surface of the particles (B1) ([average particle diameter of the particles (B1)]>[average particle diameter of the fine inorganic particles (B2)]). As a result, this resin composition can give a molded object which contains the particles in a satisfactorily dispersed state and has a low coefficient of linear expansion.</p> |
