| 摘要 |
PURPOSE: A method for fabricating a semiconductor package is provided to reduce manufacturing costs by stacking mold wafers including a semiconductor chip, a connection electrode, and a mold. CONSTITUTION: A manufacturing method of the semiconductor package comprises a process of forming a mold wafer. Semiconductor chips(110) are arranged on the carrier and they are separated with each other. Connection electrodes(120) are formed in the top side of carrier. The mold(140) is formed in the top side of the carrier in order to cover the semiconductor chips and connecting electrodes. The one-side end of the connecting electrodes is exposed to the outside. Each bonding pad of the each semiconductor chip is connected to the each connection electrode through rewiring. |
