发明名称 LEADFRAME, METHOD OF MANUFACTURING THE LEADFRAME, AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE LEADFRAME
摘要 <P>PROBLEM TO BE SOLVED: To manufacture a lead frame at low cost, having a light-reflecting ring that reflects light from a light-emitting element. <P>SOLUTION: The leadframe is manufactured which include a leadframe formed of a plurality of structures, such that a top-side upper structure and a back-side lower structure are integrated and are separated from each other, and a filling resin which surrounds the lead frame and is as thick as the lead frame, wherein the upper structure has a pad portion 2 and a lead portion 2a, and the lower structure has a heat-dissipating portion 3, integrated with the pad portion 2 and a heat dissipation portion 3a integrated with the lead portion 2a. The leadframe has a stepped portion or tapered portion, spreading from the top side to the reverse side of the lead frame, at a side face portion of the upper structure, and also has a stepped portion or tapered portion, spreading from the reverse side to the top side of the lead frame, on a side surface portion of the lower structure, the light-reflecting ring 4a, having an inclined inner peripheral surface facing the pad portion and formed integrally with the filling resin being provided outside the pad portion 2 and lead portion 2a. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010272565(A) 申请公布日期 2010.12.02
申请号 JP20090120675 申请日期 2009.05.19
申请人 TOPPAN PRINTING CO LTD 发明人 YOSHIOKA OSAMU;MOTOMURA JIN;TSUKAMOTO TAKETO
分类号 H01L33/62;H01L23/29;H01L23/31;H01L23/50 主分类号 H01L33/62
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