发明名称 PATTERN FORMING APPARATUS AND PATTERN FORMING METHOD, AND DEVICE MANUFACTURING APPARATUS, AND DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a pattern forming apparatus capable of forming an uneven pattern on a substrate without using any template. <P>SOLUTION: The pattern forming apparatus 10 forms the uneven pattern on the surface of the substrate (FB). Then the pattern forming apparatus 10 includes a contact device 12 which brings a curable material (LR), curing according to predetermined energy, into contact with the surface of the substrate (FB), and a curing device 11 which causes the curable material (LR) to cure by applying the predetermined energy to the curable material (LR) brought into contact with the surface of the substrate (FB) on the basis of pattern information corresponding to the pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010272606(A) 申请公布日期 2010.12.02
申请号 JP20090121507 申请日期 2009.05.20
申请人 NIKON CORP 发明人 TAKENAKA SHUJI
分类号 H01L21/027;B29C59/02;G03F7/20;H01L21/31;H01L21/312 主分类号 H01L21/027
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