| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonded composite containing a metal in which heat resistance is improved by eliminating a current problem that bonding strength under an environment of 80 to 90°C or higher is quickly lowered compared with an enviroment of a normal temperature in one liquid-type epoxy adhesive. SOLUTION: Bond optimal to the one liquid-type epoxy adhesive is obtained by performing NAT processing in which surfaces of various kinds of metals (1) have the roughness of micron orders, and (2) are covered with ultrafine unevenness of several tennanometer orders, and (3) formed of a metal oxide or a metal phosphorus oxide layer which are environmentally stable. The epoxy adhesive contains a proper acid anhydride as a hardner and is constituted by adding a proper inorganic filler and an ultrafine inorganic filler. Thereby, the bonding strength by a conventional epoxy adhesive is held under the normal temperature, and the bonding strength of the bonding of a metal alloys 61, 62 subjected to the NAT processing and the bonding of the metal alloy 61 subjected to the NAT processing and a CFRP material 62 is improved in a high temperature range, and a lightweight strong member for a construction material can be obtained. COPYRIGHT: (C)2011,JPO&INPIT
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