发明名称 METHOD FOR RECYCLING SCRAP OF COPPER OR COPPER ALLOY PLATED WITH NICKEL
摘要 PROBLEM TO BE SOLVED: To provide a recycling method of continuously and effectively peeling nickel from the scrap of copper or a copper alloy plated with nickel without using an expensive peeling liquid having the short life or also without etching the copper or copper alloy after the peeling operation, and using the scrap of the copper or copper alloy from which a plated nickel film has been peeled, as a raw material for producing copper or a copper alloy. SOLUTION: The recycling method includes: immersing the scrap of the copper or copper alloy having the surface plated with nickel into a treatment tank which contains an anode and a cathode for causing an electrolytic reaction, and accommodates an iron sulfate solution therein; peeling the plated nickel film by a chemical reaction of 2Fe<SP>3+</SP>+Ni&rarr;2Fe<SP>2+</SP>+Ni<SP>2+</SP>; continuously peeling the plated nickel film by regenerating consumed Fe<SP>3+</SP>while using an electrolytic reaction of Fe<SP>2+</SP>&rarr;Fe<SP>3+</SP>+e<SP>-</SP>; and using the resultant copper or copper alloy as the raw material for producing copper or copper alloy. The recycling method shows a remarkable effect when employing a peeling liquid which contains 50-600 g/l of sulfuric acid and 1-50 g/l of Fe, and employing a cathode current of 5-100 A/dm<SP>2</SP>and an anode current of 0.01-10 A/dm<SP>2</SP>in an electrolytic regeneration operation. COPYRIGHT: (C)2011,JPO&amp;INPIT
申请公布号 JP2010270357(A) 申请公布日期 2010.12.02
申请号 JP20090121701 申请日期 2009.05.20
申请人 MITSUBISHI SHINDOH CO LTD 发明人 SAKURAI TAKESHI;ISHIKAWA SEIICHI;KUBOTA KENJI
分类号 C25D5/48;C23F1/00;C23F1/46;C25D17/10 主分类号 C25D5/48
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