发明名称 |
Controlling Warpage in BGA Components in a Re-flow Process |
摘要 |
A method of manufacturing an integrated circuit package includes providing a ball grid array (BGA) module including BGA balls on a side of the BGA module; providing a base substrate; and placing the BGA module on the base substrate. The BGA balls are placed between the BGA module and the base substrate. An adhesive is applied between and contacting the BGA module and the base substrate. The adhesive is then cured. The BGA balls are re-flowed after the step of curing the adhesive.
|
申请公布号 |
US2010302749(A1) |
申请公布日期 |
2010.12.02 |
申请号 |
US20100730857 |
申请日期 |
2010.03.24 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
KAO CHIA-JEN;TSAI CHEN-FA;CHEN CHIEN-WEN |
分类号 |
H05K7/00;H01R43/00 |
主分类号 |
H05K7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|