发明名称 |
SILICA-CONTAINING EPOXY CURING AGENT AND CURED EPOXY RESIN PRODUCT |
摘要 |
The present invention provides an epoxy curing agent comprising colloidal silica particles, which is a liquid having low viscosity and excellent transparency and is suitable as a curing agent for a resin composition for sealing optical semiconductor elements. The epoxy curing agent comprises colloidal silica particles with an average primary particle size of from 5 to 40 nm and a fully saturated dicarboxylic anhydride which is a liquid at 30° C., and it has a light transmittance of at least 60% at a wavelength of 500 nm for a light path length of 10 mm when the concentration of the colloidal silica particles is adjusted to 10 mass %.
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申请公布号 |
US2010305237(A1) |
申请公布日期 |
2010.12.02 |
申请号 |
US20080745449 |
申请日期 |
2008.10.30 |
申请人 |
NISSAN CHEMICAL INDUSTRIES, LTD. |
发明人 |
SUEMURA NAOHIKO;TAKEYAMA TOSHIAKI |
分类号 |
C08L63/00;C09K3/00 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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