| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment technique appropriately controlling a pressure in a treatment vessel for setting the pressure to a desired pressure state by controlling a flow of gas in a treatment vessel for treating substrates. SOLUTION: A substrate treating device 1 introduces treatment gas into the treatment vessel 2 and exhausts air for treating a substrate G placed on a mount table 4 in the treatment vessel 2. The substrate treating device 1 includes: a partitioning member 6 for partitioning the periphery of the mount table 4 into a plurality of regions 15 in the treatment vessel 2; a plurality of air outlets 5 that are provided at each of a plurality of regions 15 partitioned by the partitioning member 6 on a bottom face 2a of the treatment vessel 2 and exhaust treatment gas; an exhaust mechanism 55 that is connected to each of the plurality of air outlets 5 for operating individually; a sensor 47 for detecting pressure in each region 15; and a control unit 45 for individually controlling the exhaust mechanism 55, based on pressure detected by the sensor 47. COPYRIGHT: (C)2011,JPO&INPIT
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