ELECTRONIC COMPONENT MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a means for improving connection reliability by substantially eliminating trouble such as the increase or disconnection, etc., of an electric resistance owing to an electric substance movement in a connection part when using an electronic component (in energization) after mounting on a wiring substrate.

SOLUTION: An electronic component (a chip) mounting structure 50 includes: the chip 10 having terminals 11; the wiring substrate 20 having terminals 22P to be electrically connected to the terminals 11 of the chip; and an intervention substrate 30 arranged between the chip 10 and the wiring substrate 20 and having a structure where an insulating base material 31 includes multiple linear conductors 32 penetrating in the thickness direction. The terminals 11 of the chip 10 are electrically connected to the terminals 22P of the wiring substrate 20 via a plurality of linear conductors arranged in the intervention substrate 30.

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