| 摘要 |
PROBLEM TO BE SOLVED: To reduce stress to be applied to a function element in a sealed electronic component by mounting the function element such as a semiconductor element. SOLUTION: An electronic component 100 includes the other substrate 1 in which a function element connected via a bump 20 is provided on one substrate P, the function element is disposed within a sealed space K formed between the one substrate P and the other substrate 1 and in order to maintain an environment inside the sealed space K, a sealing thin film 2 is provided which is formed over the other substrate 1 on the substrate P whereon the other substrate 1 is disposed. COPYRIGHT: (C)2011,JPO&INPIT
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