| 摘要 |
<p>An IC medium has a first fold-removal line that is formed so as to surround the area wherein an IC carrier is to be installed. The IC medium also has a second fold-removal line that is formed so as to connect a first point on the outer circumference, and a second point on the first fold-removal line. The IC medium also has a third fold-removal line that is formed so as to connect a third point on a side on the outer circumference that is different from the side on which the first point exists, and a fourth point on a side on the first fold-removal line that is different from the side on which the second point exists.</p> |
