| 摘要 |
A copper alloy material, containing Ni 1.8 to 5.0 mass% and Si 0.3 to 1.7 mass%, at a ratio of contents of Ni and Si, Ni/Si, of 3.0 to 6.0, and having a content of S of less than 0.005 mass%, with the balance of being Cu and inevitable impurities, wherein the copper alloy material satisfies formulae (1) to (4): 130 × C + 300 ‰¤ TS ‰¤ 130 × C + 650 0.001 ‰¤ d ‰¤ 0.020 W ‰¤ 150 10 ‰¤ L ‰¤ 800
wherein TS represents a tensile strength (MPa) of the copper alloy material in a direction parallel to rolling; C represents the content (mass%) of Ni in the copper alloy material; d represents an average grain diameter (mm) of the copper alloy material; W represents a width (nm) of a precipitate free zone; and L represents a particle diameter (nm) of a compound on a grain boundary.
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