A TEMPLATE FOR FORMING SOLDER BUMP AND A METHOD FOR MANUFACTURING THE TEMPLATE

摘要

PURPOSE: A template for forming a solder bump and a method for manufacturing the template are provided to improve the productivity and reduce the manufacturing cost by reducing the time and the cost required for manufacturing the template of same shape. CONSTITUTION: A substrate(110) is included in the panel shape. A coating layer(120) is formed on the surface of the substrate. A plurality of grooves(111) is formed on one side of the substrate. The groove forms the space where the solder is accepted in as the solder bump is formed. A plurality of protrusions(10a) is formed on one side of a stamp(10).