发明名称 Enhancing adhesion of molding materials with substates
摘要 A method of enhancing adhesion of a molding material (202) with a substrate (102) is provided. The method includes forming one or more perforations (108) on the substrate (102), forming a coat of an affinitive material on at least one of the perforations (108), and filling the molding material (202) in the perforations (108). The affinitive material has an affinity for the molding material (202). Therefore, the molding material (202) adheres to the coat of the affinitive material.
申请公布号 EP2257140(A1) 申请公布日期 2010.12.01
申请号 EP20100160469 申请日期 2010.04.20
申请人 MOSER BAER INDIA LIMITED 发明人 SINGH, JITENDER PRATAP;MALHI, VIJAY
分类号 H05K3/28 主分类号 H05K3/28
代理机构 代理人
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