发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a holding member for holding an electronic component on a substrate with higher strength while reducing damage to the wall face of a through-hole, and to provide the electronic component and an electronic device. <P>SOLUTION: The holding member has a leg part to be inserted into the through-hole of the substrate to hold the electronic component on the surface of the substrate. It comprises a base part to be fixed to the electronic component which is integrally formed with the same metal plate, and at least one leg part extending from the base part. The leg part consists of a locking portion provided at the front end thereof and having at least part located on the opening periphery of the through-hole in the reverse of the substrate in the fixing state of the electronic component, a connection portion having one end connected to the locking portion and part arranged in the through-hole in the fixing state, and a spring portion having one end connected to the end of the connection portion on the opposite side to the locking portion, and arranged on the surface of the substrate in the fixing state, the spring portion being displaced during inserting the locking portion and the connection portion into the through-hole so that the connection portion is inclined in the fixing state and the locking portion is inserted into the through-hole. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP4591514(B2) 申请公布日期 2010.12.01
申请号 JP20080008360 申请日期 2008.01.17
申请人 发明人
分类号 H01R12/16 主分类号 H01R12/16
代理机构 代理人
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