| 摘要 |
<p>A connector pad (12) is provided having a base (22), a top (24) opposite the base, and tapered sidewalls (26) therebetween. The tapering minimizes stress concentrations when the connector (36) is bonded into, or on the surface of a structure. The connector pad consists of a plurality of structural load carrying plies (28) suitable for sandwiching a flat structurally integrated wiring array (20) therebetween. A plurality of plated through holes (32) formed in the connector pad (12) enable access to the wiring array therein. <IMAGE></p> |
