发明名称 |
Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
摘要 |
<p>The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.</p> |
申请公布号 |
EP2257141(A2) |
申请公布日期 |
2010.12.01 |
申请号 |
EP20100175398 |
申请日期 |
2007.08.20 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
ARIFUKU, MOTOHIRO;MOCHIZUKI, NICHIOMI;KOBAYASHI, KOUJI;NAKAZAWA, TAKASHI;TATSUZAWA, TAKASHI;MASUDA, KATSUYUKI;EJIRI, TAKAKO |
分类号 |
H05K3/32;C08G73/10;C09J9/02;C09J11/08;C09J163/00;C09J179/08;H01B1/22;H01B1/24;H01B3/00;H01R4/04 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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