CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX

摘要

PURPOSE: A cleaner composition for removing lead-free soldering flux is provided to ensure excellent detergency in a lead-free soldering flux and low environmental loads. CONSTITUTION: A cleaner composition for removing lead-free soldering flux comprises (a) 0.001-5 weight% polymethyl alkyl siloxane-based surfactant represented by chemical formula 1, (b) 1-90 weight% tetrahydrofurfuryl alcohol represented by chemical formula 2, and (c) 1-20 weight% non-halogen organic solvent. In chemical formula 1, R1 is hydrogen or C 1-8 alkyl group of.