发明名称 LASER MANUFACTURING APPARATUS AND METHOD FOR EMC
摘要 PURPOSE: A laser manufacturing apparatus and method for EMC, capable of being applied to a massive manufacturing line, is provided to cut protruding glass material from a barrier of an EMC hole in which CO2 particles are formed. CONSTITUTION: A laser manufacturing apparatus for EMC comprises a laser processing unit(110) and a CO2 cleaning unit(120). The laser processing unit emits a laser to an EMC coated substrate to form a ground terminal hole(12a). The ground terminal hole is electrically connected with a chip. The chip is formed on the substrate. The CO2 cleaning unit emits CO2 solid particles to the hole to remove residual materials produced during laser machining.
申请公布号 KR20100126114(A) 申请公布日期 2010.12.01
申请号 KR20090045185 申请日期 2009.05.22
申请人 EO TECHNICS CO., LTD. 发明人 JEON, EUN SUK;SEONG, CHEON YA;PARK, SANG YOUNG
分类号 B23K26/14;B23K26/18;B23K26/36;H01S3/00 主分类号 B23K26/14
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