发明名称
摘要 <p>PROBLEM TO BE SOLVED: To provide an inexpensive wafer support member, holding tool and holding device, which can fully suppress slippages without impairing productivity in the high temperature heat treatment of a silicon wafer. SOLUTION: The support member is arrange on the wafer-holding tool, and the wafer is placed on an upper part. The support member is constituted of three structures which are an upper part 21, an intermediate part 22 and a lower part 23. In the wafer support member, the material of the intermediate part structure 22 is constituted of a soft material, softened at a wafer thermal treatment temperature.</p>
申请公布号 JP4589545(B2) 申请公布日期 2010.12.01
申请号 JP20010042476 申请日期 2001.02.19
申请人 发明人
分类号 H01L21/324;H01L21/683;H01L21/02;H01L21/26;H01L21/68;H01L27/12 主分类号 H01L21/324
代理机构 代理人
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