| 摘要 |
A patch antenna structure, or a method of manufacturing a patch antenna, comprises two dielectric material layers 608, 614 with a plurality of height controlled structures 622. A patch antenna 616 is formed on one surface of a first dielectric layer 614 and a ground layer 610 with an aperture 611 is formed on a surface of a second dielectric layer 608. The patch 616 and aperture 611 are aligned with each other with their respective surfaces facing one another when the dielectric layers 608, 614 are secured to and separated from one another by the plurality of height controlled structures 622. The said height controlled structures 622 comprise solder balls and connection pads, where the solder balls have a core material with a higher melting temperature than that of the surrounding solder material. The solder balls serve to control the separation of the first and second layers 608, 614, thereby determining the height of a void between those layers. A feed line 606 may be arranged on or adjacent to the first or second surface of the second dielectric layer 608. Conventional flip-chip assembly may provide an a patch antenna with a suitable air gap, accurate alignment and spacing of the components.
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