POLYIMIDE PRECURSOR, PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE DRY FILM, AND FLEXIBLE PRINTED CIRCUIT BOARD USING THOSE MATERIALS

摘要

Disclosed is a polyimide precursor: which enables the production of such a photosensitive dry film that has no tackiness, causes no cracking in a photosensitive layer thereof when folded after removal of a solvent therefrom, and can achieve good lithography thereon; which can be applied to a FPC that causes less warpage after baking; and which can exhibit flame retardancy without the need of adding any halogen compound thereto. Also disclosed is a photosensitive polyimide precursor composition. Further disclosed is a photosensitive dry film. Still further disclosed is a flexible printed circuit board produced by using any one of the aforementioned materials. The polyimide precursor is characterized by comprising an acid dianhydride represented by general formula (1) [wherein X represents a bivalent organic group having a C3-30 alkylene group; and R1 represents a hydrogen atom, a C1-10 univalent alkyl group, an alkoxy group or a halogen group].