发明名称 Component shape profiling method and component mounting method
摘要 A method for profiling the shape of a component using a line sensor (110) which is provided in a component mounter (100) and which profiles the shape of the component (200) three-dimensionally by (a) projecting a sweeping light onto the component (200) in a relative movement between the line sensor (110) and the component (200) held by a mounting head (103) so that the sweeping light traverses the direction of the movement and (b) detecting the reflected light from the component using a detector (119). The method includes getting the component (200) from the component supply unit 101 using the mounting head (103), rotating the component (200) by a predetermined angle within a predetermined surface, and profiling the shape of the rotated component using the line sensor (110).
申请公布号 US7843573(B2) 申请公布日期 2010.11.30
申请号 US20060667312 申请日期 2006.03.07
申请人 PANASONIC CORPORATION 发明人 HADA JUNICHI;HACHIYA EIICHI
分类号 G01B11/24 主分类号 G01B11/24
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