| 摘要 |
A honeycomb structure 1 formed by bonding into one piece, via a bonding layer 8, a plurality of honeycomb segments 12, the honeycomb segment having an outer wall 7, partition walls 2 provided inside the outer wall, and a large number of through-holes 3 divided by the partition walls 2 and extending in the axial direction of the segment is provided. The honeycomb structure characterized by comprising the outer wall 7 and the bonding layer 8 having a relation of <DF>d/Ä( kappa a/da)+( kappa C/dc)Ü >/= kappa >/= d/Ä( kappa a/da)+( kappa C/dc)Üx0.6 </DF> wherein kappa C (W/mK) and dc (cm) are respectively the thermal conductivity and thickness of the outer wall 7, kappa a (W/mK) and da (cm) are respectively the thermal conductivity and thickness of the bonding layer 8 formed on the outer wall 7, and kappa (W/mK) and d (cm) are respectively the thermal conductivity and thickness of a layer which is the sum of the outer wall and the bonding layer; and a process for production thereof are provided. The honeycomb structure can prevent excessive temperature increase and is superior in durability. <IMAGE> |
