发明名称 APPARATUS FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
摘要 PURPOSE: An apparatus and a method for manufacturing a light emitting diode package are provided to improve yield and decrease the number of manufacturing processes by spraying adhesive on an opening of a body group once. CONSTITUTION: A plurality of opening units are formed on a base unit(110) and a body group mounting a light emitting diode on the respective opening units is arranged on one side of the base unit. A mask(130) has a pattern corresponding to the opening units. Adhesive is coated on the opening by a spray unit(140).
申请公布号 KR20100125092(A) 申请公布日期 2010.11.30
申请号 KR20090044122 申请日期 2009.05.20
申请人 LUMENS CO., LTD. 发明人 OH, SEUNG HYUN;KIM, BYUNG SOON
分类号 H01L33/56 主分类号 H01L33/56
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