发明名称 |
APPARATUS FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE |
摘要 |
PURPOSE: An apparatus and a method for manufacturing a light emitting diode package are provided to improve yield and decrease the number of manufacturing processes by spraying adhesive on an opening of a body group once. CONSTITUTION: A plurality of opening units are formed on a base unit(110) and a body group mounting a light emitting diode on the respective opening units is arranged on one side of the base unit. A mask(130) has a pattern corresponding to the opening units. Adhesive is coated on the opening by a spray unit(140).
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申请公布号 |
KR20100125092(A) |
申请公布日期 |
2010.11.30 |
申请号 |
KR20090044122 |
申请日期 |
2009.05.20 |
申请人 |
LUMENS CO., LTD. |
发明人 |
OH, SEUNG HYUN;KIM, BYUNG SOON |
分类号 |
H01L33/56 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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