发明名称 Wire clamp and wire bonding apparatus having the same
摘要 A wire clamp includes a pair of clamp arms at a predetermined distance from each other to define an interval therebetween for a bonding wire, a clamp body coupled to the clamp arms, the clamp body configured to adjust the predetermined distance between the clamp arms with respect to a process to be performed, a clamping section in each clamp arm, the clamping section having concave portions facing the interval between the clamp arms, the concave portions being configured to contact the bonding wire when the clamp arms are brought close together, and at least one abrasion prevention member in each clamping section, the abrasion prevention members being configured to prevent abrasion during contact with the bonding wire.
申请公布号 US7841505(B2) 申请公布日期 2010.11.30
申请号 US20090320964 申请日期 2009.02.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE SUNG-SOO;OH KI-TAIK;KIM JUNG-HYEON
分类号 B23K37/00 主分类号 B23K37/00
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