发明名称 High level integration phase change memory device having an increased diode junction area and method for manufacturing the same
摘要 A phase change memory device includes a semiconductor substrate active region, a plurality of first conductivity type silicon pillars, and a plurality of second conductivity type silicon patterns. The plurality of first conductivity type silicon pillars is formed on the semiconductor active region such that each first conductivity type silicon pillar is provided for two adjoining cells. The plurality of second conductivity type silicon patterns is formed on the plurality of first conductivity type silicon pillars such that two second conductivity type silicon patterns are formed on opposite sidewalls of each first conductivity type silicon pillars. Two adjoining cells together share only one first conductivity type silicon pillar and each adjoining cell is connected to only one second conductivity type silicon pattern which constitutes a PN diode which serves as a single switching element for each corresponding cell.
申请公布号 US7843037(B2) 申请公布日期 2010.11.30
申请号 US20080346187 申请日期 2008.12.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KIM KYUNG DO
分类号 H01L29/00 主分类号 H01L29/00
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