发明名称 |
Plasma process for removing excess molding material from a substrate |
摘要 |
A method for removing thin layers of a two-component molding material from areas on a substrate. The method includes using a plasma formed using a first gas mixture for removing one component of the molding material and a plasma formed using a different second gas mixture for removing the other component of the molding material. For filled epoxies commonly used as molding materials, the first gas mixture may be an oxygen-rich mixture of an oxygen-containing gas species and a fluorine-containing gas species, and the second gas mixture may be a fluorine-rich mixture of the same gases. |
申请公布号 |
US7842223(B2) |
申请公布日期 |
2010.11.30 |
申请号 |
US20040021341 |
申请日期 |
2004.12.22 |
申请人 |
NORDSON CORPORATION |
发明人 |
GETTY JAMES D.;ZHAO JIANGANG |
分类号 |
B23K26/38;B29C35/08;C23F1/00;H01S3/00 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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