发明名称 PCB MANUFACTURING METHOD USING HIGH RADIATION METAL PLATE
摘要 PURPOSE: A method for manufacturing a PCB is provided to improve the lifetime and performance of an LED and a PCB by efficiently discharging heat generated from the LED. CONSTITUTION: An aluminum plate is wet-cleaned(S10). The wet-cleaned aluminum plate is mounted inside a plasma chamber(S20). The aluminum plate is plasma-cleaned(S30). A base metal layer is deposited on the aluminum plate(S40). A DLC(Diamond-Like Carbon) thin film is deposited on the base metal layer(S50). A DLC thin film is deposited on the DLC thin film containing metal(S60). A PCB is made by using the aluminum plate(S80).
申请公布号 KR20100124960(A) 申请公布日期 2010.11.30
申请号 KR20090043930 申请日期 2009.05.20
申请人 KWEON, O KUK 发明人 KWEON, O KUK
分类号 H05K3/00;H05K7/20 主分类号 H05K3/00
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