| 摘要 |
<p>Device (1) and method for wet treatment of wafers comprising a first plate (31), a second plate (32) parallel to the first plate, holding means (35) for holding a wafer (W) between the plates parallel to the plates, a first dispensing means (21) for introducing fluid into a first gap (G1) between the first plate and a wafer when being treated, a second dispensing means (6) for introducing fluid into a second gap (G2) between the second plate and a wafer when being treated, at least one vibrating element (4) acoustically coupled to at least the second plate, and rotating means (8) for rotating the holding means and the second plate relative to each other (figure 1).</p> |
