LED PACKAGE AND LED RADIANT HEAT DEVICE, AND LED SOCKET DEVICE USING THE SAME

摘要

PURPOSE: An LED(Light Emitting Diode) element, an LED heat dissipation device, and an LED socket device are provided to prevent the degradation of the photonic efficiency of an LED and to maintain the lifespan of an LED by directly arraying the LED on a heat dissipation plate. CONSTITUTION: An LED mounting part is formed in the center of a heat dissipation slug(101). The LED mounting part has at least one penetration hole. An LED chip(103) is installed on the upper surface of the LED mounting part. An electrode pin(104) is inserted into the penetration hole of the LED mounting part. An insulating layer(105) is formed between the heat dissipation slug and the electrode pin. An insulating plate(108) is formed on the lower surface of the electrode pin. A bonding wire interlinks the LED chip and the electrode pin. An encapsulating material hermetically seals the upper part of the LED mounting part.