发明名称 FILM FORMING APPARATUS
摘要 PURPOSE: A film depositing apparatus is provided to suppress the deviation between film depositing processes with respect to substrates by uniformly dispersing heat on the substrates. CONSTITUTION: A gas supplying unit supplies a processing gas, including a raw-material gas, to a substrate. A supporting unit supports the lower side of a loading unit. A heating unit is installed on the loading unit. A temperature detecting unit detects the temperature of the substrate. The bottom side of a processing container(20) is connected with one end of an exhaust pipe(29). Based on the temperature detected by the temperature detecting unit, a controlling unit controls the amount of heat generated by the heating unit.
申请公布号 KR20100124222(A) 申请公布日期 2010.11.26
申请号 KR20100101478 申请日期 2010.10.18
申请人 TOKYO ELECTRON LIMITED 发明人 IKEDA KYOKO;SEGAWA SUMIE;SAWADA IKUO
分类号 H01L21/205 主分类号 H01L21/205
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