发明名称 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 PURPOSE: By thinning and uniformly forming the repellent water processor film on the first plating layer the laminated electronic part and manufacturing method thereof effectively prevent the moisture invasion from the crevice of the distal edge of the first plating layer and component body. CONSTITUTION: The laminated electronic part(1) comprises the component body(2) of the laminating structure. A plurality of inner electrodes is formed inside the component body. The component body comprises the inner electrode on a plurality of layer types formed according to interface between the insulator layer and laminated a plurality of insulator layers(5).
申请公布号 KR20100124212(A) 申请公布日期 2010.11.26
申请号 KR20100044830 申请日期 2010.05.13
申请人 MURATA MANUFACTURING CO., LTD. 发明人 MOTOKI AKIHIRO;OGAWA MAKOTO;KAWASAKI KENICHI;TAKEUCHI SHUNSUKE
分类号 H01G13/00;H01G4/30 主分类号 H01G13/00
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