| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board provided with a land for solder-connecting a heat spreader of a semiconductor package and capable of efficiently radiating the heat from the land of a low cost two-layer board. SOLUTION: A wiring board 13, which includes a plurality of lands 1 for solder-connecting the heat spreader (not shown) of the semiconductor package (not shown), and a plurality of through-holes 2 passing through the lands 1 and a board body, surface-mounts the semiconductor package. The surface of the lands 1 is uniformly formed without a gap in between except the through-holes 2, and the area of the lands 1, including the through-holes 2, is 90% or more of the area of the facing surface of the heat spreader. COPYRIGHT: (C)2011,JPO&INPIT
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