发明名称 |
ALLOY SOLDER AND ALLOY SOLDER MANUFACTURING METHOD |
摘要 |
The present invention solves the problem of the bonding strength of a Pb-free alloy solder being inferior to that of the conventional Pb-containing alloy solder and provides a Pb-free alloy solder satisfactory in bonding reliability. An alloy solder is manufactured by adding a predetermined amount of carbon to a Pb-free solder in a high-temperature atmosphere of a temperature in the range of 800° C. to 1200° C. An alloy solder manufacturing method includes a melting process for melting a Pb-free solder by heating the Pb-free solder in a high-temperature atmosphere of a temperature in the range of 800° C. to 1200° C., a carburizing process for carburizing the molten Pb-free solder held in the high-temperature atmosphere by adding a predetermined amount of carbon to the molten Pb-free solder, a stirring process for stirring a mixture of the molten Pb-free solder and carbon, and a cooling process for cooling the mixture of the Pb-free solder and carbon stirred by the stirring process and poured into a mold to solidify the mixture.
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申请公布号 |
US2010296965(A1) |
申请公布日期 |
2010.11.25 |
申请号 |
US20080735038 |
申请日期 |
2008.12.11 |
申请人 |
SHIROGANE CO., LTD.;UNIVERSITY OF TSUKUBA |
发明人 |
IJICHI YOSHIHITO;OSHIMA KENICHI |
分类号 |
C22C13/00;C22B25/00 |
主分类号 |
C22C13/00 |
代理机构 |
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代理人 |
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地址 |
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