发明名称 PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD
摘要 <p>A printed circuit board (1) comprises a board (11), a plurality of first interconnects (12) provided on the front surface of the board (11), and a plurality of second interconnects (13) provided on the back surface of the board (11). Connection parts (14) are provided between portions of the first interconnects (12) and portions of the second interconnects (13) and do not stick out from the inside of the region where the portions of the first interconnects (12) overlap the portions of the second interconnects (13). The connection parts (14) are disposed so that, when seen from a plan view from the board front surface side, the connection parts (14) extend across the space between a pair of sides, running along the interconnect extension direction, of each first interconnect (12), and extend across the space between a pair of sides, running along the interconnect extension direction, of each second interconnect (13).</p>
申请公布号 WO2010134285(A1) 申请公布日期 2010.11.25
申请号 WO2010JP03190 申请日期 2010.05.11
申请人 SUMITOMO BAKELITE CO., LTD.;ISHIKAWA, EIJI 发明人 ISHIKAWA, EIJI
分类号 H05K1/11;H05K3/06;H05K3/40 主分类号 H05K1/11
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