| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that it has been difficult to perform the attachment/detachment of a wafer to/from a wafer holder and the attachment/detachment of the wafer holder to/from each device exactly, at a high speed, and stably in recent years in which the diameter of the wafer tends to increase. SOLUTION: A semiconductor processing device includes a substrate holder for holding a substrate and a stage for mounting the substrate holder. The substrate holder is provided with an electrostatic attraction section for holding the substrate and a through-hole provided in a holding surface for holding the substrate. The stage is provided with: a first suction conduit with an opening at one end connected with the through-hole on the mounting surface for mounting the substrate holder; and a second suction conduit with an opening at one end opposed to the substrate holder without being connected with the through-hole on the mounting surface. COPYRIGHT: (C)2011,JPO&INPIT |
